Substrate processing system and substrate processing method

ABSTRACT

Disclosed is a substrate processing method that dissolves and deforms a photoresist film having a first pattern formed on a substrate to reshape the resist film into a second pattern. During the reflow process, an atmosphere of a thinner vapor-containing gas is established in a processing chamber. A substrate is placed on a temperature adjusting plate. The target temperature of the temperature adjusting plate is set and controlled by a control unit, and the temperature of the temperature adjusting plate is controlled by a temperature regulator based on the target temperature set by the control unit. The control unit set and controls the target temperature so that it meets the following requirement: the atmospheric temperature≦the target temperature≦(the atmospheric temperature+2° C.). Due to the above, the reflowing of the resist can be performed stably, while achieving a satisfactory reflow rate although it is somewhat low.

CROSS-REFERENCE TO RELATED APPLICATIONS

This present application is a Divisional application of Ser. No.11/693,244 filed Mar. 29, 2007, the entire contents of which areincorporated herein by reference, and which claims the benefit ofpriority from Japanese application no. 2006-094692 filed Mar. 30, 2006.

TECHNICAL FIELD

The present invention relates to a substrate processing system and asubstrate processing method for dissolving a resist film, having beenmade by photolithography and used as an etch mask, to reflow the resistfilm so as to reshape the same into a new pattern.

BACKGROUND ART

In amorphous silicon TFT (thin film transistor) forming processesincluded in an LCD (liquid crystal display) fabrication, an etchingprocess must be carried out for plural times. Thus, with theconventional art, a photolithography process including an exposingprocess and a developing process is carried out for plural timescorresponding to the number of the etching processes. Differentcoating-and-developing apparatuses and exposure apparatuses are requiredfor forming different patterns for respective etching processes in a TFTforming process, and the total system cost is thus expensive.

As one solution of the above problem, a reflow process, which dissolvesand deforms a resist film of a first pattern once used as an etch maskto reshape the same into a new, second pattern, attracts attention inthese days. With the use of the reflow process, it is not necessary forforming the second resist pattern to perform processes employing acoating-and-developing apparatus and an exposure apparatus. The reflowprocess not only reduces the total system cost but also improves theproduction efficiency.

A series of processes for formation of an amorphous silicon TFTincluding a reflow process will be described with reference to FIG. 10.As shown in FIG. 6( a), on a gate electrode 201 formed on a glasssubstrate 200, an insulating layer 202, an Si-layer 203 composed of ana-Si layer (i.e., non-doped amorphous Si layer) 203 a and an n⁺a-Silayer (i.e., phosphor-doped amorphous Si layer) 203 b, and a metal layer205 for forming drain and source electrodes are stacked in that order.

Then, in order to etch the metal layer 205, by a photolithographyprocess, a resist film 206 is formed on the metal layer 205 and a firstpattern is formed in the resist film 206 through an exposing step and adeveloping step. A half exposing technique is used in the exposing stepso as to obtain the resist film 206 having thickness distribution (i.e.,the resist film 206 has thick portions and thin portions.). The halfexposing technique employs a half-tone mask having light-transmittancedistribution. The half exposing technique is described in US2004126713A1(JP2005-108904A), for example. The resist film 206 having the firstpattern is used as an etch mask for etching the metal layer 205, andportions of the metal layer 205 which are not covered with the mask areetched and removed, as shown in FIG. 6( b).

Altered layer 207 is formed in the surface region the resist film 206due to application of a wet etching liquid used for etching the metallayer 205. As a pre-treatment of a reflow process, the altered layer 207is removed by supplying thereto an alkaline solution, as shown in FIG.6( c).

Then, as shown in FIG. 6( d), portions of the resist film 206 which arenot necessary for a second etching process (i.e., the thin portions ofthe resist film 206) are removed by re-developing process, whileportions of the resist film 206 near targets Tg (i.e., the thickportions of the resist film 206) remain.

Then, the remaining resist film 206 as shown in FIG. 6( d) is exposed toa solvent vapor-containing atmosphere. Thereby, the resist film 206dissolves and diffuses (i.e., reflow) to move onto the targets Tg tocover the same. Thus, the resist film 206 is reshaped into a secondpattern, in other words, a second resist pattern is formed. Then, the Silayer 203 is etched by using the metal layer 205 and the resist film 206as masks, as shown in FIG. 7( a); and the resist film 206 is removed, asshown in FIG. 7( b). Thereafter, the n⁺a-Si layer 203 in channel regionsis etched so that a TFT structure is formed, as shown in FIG. 7( c).

In the foregoing reflow process, the substrate is placed on thetemperature adjusting plate whose temperature is set to a predeterminedconstant value, and the substrate whose temperature is adjusted by thetemperature adjusting plate is exposed to a solvent atmosphere such as athinner gas atmosphere that dissolves the photoresist and reshapes itinto a new pattern.

The foregoing reflow process, however, has a problem that it isdifficult to appropriately reflow the resist film. That is, depending onthe process conditions of the reflow process, the resist film, in somecases, reflows excessively to spread wider than desired so that thetargets to be masked are not sufficiently covered by the resist film, orthe resist film, in some cases, reflows slowly so that sufficientprocess efficiency can not be achieved.

SUMMARY OF THE INVENTION

The object of the present invention is to provide a technique forreflowing the resist film by which the targets to be masked can becovered by the re-flown resist film while sufficient process efficiencycan be achieved

The present inventor focused particular attention on the relationshipbetween the substrate temperature and the temperature of the solventatmosphere, studied it carefully, and finally found the relationshipshown in FIG. 8. As shown in FIG. 8, in a case where the substratetemperature (24° C.) is lower than the temperature of the solventatmosphere, the greater the difference between those temperatures is,the larger the amount of diffusion of the photoresist is. Note that theterm “the amount of diffusion of the photoresist” is defined by theexpression “((Resist Width After Reflow minus Resist Width BeforeReflow)/2). The inventor considers that this relationship is resultedfrom the fact that the condensation of the solvent gas on the substratesurface is more likely to occur when the temperature of the solventatmosphere minus the substrate temperature is larger.

FIG. 8 also shows that, in a case where the substrate temperature (24°C.) is equal to or higher than the temperature of the solventatmosphere, if the substrate temperature is higher than the atmospherictemperature by 0° C. to 2° C., the amount of diffusion of thephotoresist is 2.43 μm to 0.54 μm which is somewhat small but issatisfactory; if the substrate temperature is higher than thetemperature of the solvent atmosphere by more than 2° C., the amount ofdiffusion of the photoresist is changed little according to the increaseof the difference between the substrate temperature and the temperatureof the solvent atmosphere.

The relationship shown in FIG. 8 means that, if the substratetemperature is considerably lower than the temperature of the solventatmosphere, the photoresist dissolving rate is excessively large andthus the amount of diffusion of the photoresist is excessively large. Inthis case, the targets to be masked can not sufficiently be covered bythe reflown photoresist film. On the contrary, if substrate temperatureis higher than the temperature of the solvent atmosphere by more than 2°C., the dissolving of the photoresist hardly progresses. In this case, aconsiderably long time is required for the reflow process, resulting inreduction in the production efficiency.

The inventor also found that, if the substrate temperature is set to belower than the temperature of the solvent atmosphere, the substratetemperature changes during the reflow process as shown in the graph ofFIG. 9, and thus in-plane uniformity of the substrate temperature isdeteriorated. In this case, the amount of diffusion of the photoresistvaries by site on the surface of the substrate, and thus in-planeuniformity of the resist film thickness is deteriorated. This may causedefects in the resultant circuits such as disconnections orshort-circuiting.

The present invention has been made in view of the foregoing outputs ofthe present inventor's study, and thus the present invention provides,in a first aspect thereof, a substrate processing apparatus thatdissolves and deforms a photoresist film having a first pattern formedon a substrate to reshape the resist film into a second pattern, theapparatus including: a processing chamber; a temperature adjusting platearranged in the processing chamber, the temperature adjusting platehaving a substrate supporting surface on which a substrate is to beplaced; a temperature regulator adapted to control a temperature of thesubstrate supporting surface to coincide with a target temperature ofthe substrate supporting surface so as to control a temperature of thesubstrate; a solvent supply system adapted to supply an atmospherecontaining a solvent, the solvent having an ability to dissolve aphotoresist film; an atmospheric temperature sensor adapted to detect anatmospheric temperature in the processing chamber; and a control unitadapted to receive a detection signal expressing an atmospherictemperature in the processing chamber detected by the atmospherictemperature sensor, and adapted to set the target temperature of thesubstrate supporting surface, the control unit being configured tocompare the target temperature which is being set at that time with theatmospheric temperature detected by the atmospheric temperature sensorand controls the target temperature based on a comparison result.

The present invention also provides, in a second aspect thereof, asubstrate processing method that dissolves and deforms a photoresistfilm having a first pattern formed on a substrate to reshape the resistfilm into a second pattern, the method including: placing a substrate ona substrate supporting surface of a temperature adjusting plate disposedin a processing chamber; adjusting a temperature of the substratesupporting surface to coincide with a target temperature; supplying anatmosphere containing a solvent having an ability to dissolve aphotoresist film; detecting an atmospheric temperature in the processingchamber; comparing the target temperature which is being set at thattime with the atmospheric temperature thus detected; and controls thetarget temperature based on a comparison result.

Preferably, the target temperature is controlled so as to satisfy thefollowing condition: the atmospheric temperature≦the targettemperature≦(the atmospheric temperature+2° C.).

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic diagram showing the planar arrangement of a reflowpattern forming apparatus including a reflow unit that performs a reflowprocess according to the present invention;

FIG. 2 is a cross-sectional view schematically showing the structure ofthe reflow unit in FIG. 1 in one embodiment of the present invention;

FIG. 3 is a flowchart showing processes performed in the reflow patternforming apparatus shown in FIG. 1;

FIG. 4 is a flowchart showing process steps performed in the reflow unitof FIG. 2 in one embodiment of the present invention;

FIG. 5 is a cross-sectional view schematically showing the structure ofa reflow unit in another embodiment of the present invention;

FIG. 6 shows cross-sectional views of a substrate for explaining a thinfilm transistor (TFT) fabricating processes including a reflow process;

FIG. 7 shows cross-sectional views of the substrate for explaining theTFT fabricating processes succeeding the processes shown in FIG. 6;

FIG. 8 is graph showing the relationship between a substrate temperatureand an amount of diffusion of a photoresist; and

FIG. 9 is a graph showing the change in a substrate surface temperaturewith time in connection with the atmospheric temperature in a chamberand a temperature of a temperature adjusting plate.

DESCRIPTION OF PREFERRED EMBODIMENTS

Preferred embodiments of the present invention will be described withreference to the attached drawings. As shown in FIG. 1, a reflow patternforming apparatus 1, a coating-and-developing apparatus (COT/DEV) 50, anexposure apparatus (Exp) 51, and an etching apparatus (Etching) 52 areprovided in a factory. In a TFT fabrication, a resist (photoresist) filmof a first pattern is formed on a substrate G by using thecoating-and-developing apparatus 50 and the exposure apparatus (Exp)employing a photolithography process. Then, the substrate G is subjectedto an etching process in the etching apparatus 52. Thereafter, thesubstrate G is transferred to the reflow pattern forming apparatus 1, inwhich the substrate G having the resist film of the first pattern issubjected to a reflow process so that the resist film is reshaped into asecond pattern.

The reflow pattern forming apparatus 1 is provided with a cassettestation (C/S) 2, to and from which a cassette holding therein pluralsubstrates G is delivered from and to an external apparatus (e.g., theetching apparatus 52), and at which a substrate G is loaded and unloadedinto and from a cassette.

A substrate processing block 3 is connected to the cassette station 2.Extending in the center portion of the substrate processing block 3 is asubstrate transfer unit 4, in which a substrate transfer arm (not shown)is arranged to load and unload a substrate G into and from respectivesubstrate processing units arranged on both sides of the substratetransfer unit 4 so as to transfer the substrate G between the substrateprocessing units.

The substrate processing block 3 includes, as the substrate processingunits, a remover unit (RM) 5, a re-development unit (RDV) 6, and areflow unit (RF) 7, which are arrayed in that order on the right side ofthe substrate transfer unit 4 along the substrate transfer direction asindicated by an arrow. A thermal treatment unit (HP/COL) 3 having pluralhot plates and cooling plates is arranged on the left side of thesubstrate transfer unit 4. The task of the remover unit 5 is to performa pre-treatment that removes an altered layer of a resist film. The taskof the re-development unit 6 is to re-develop the resist film to removetherefrom unnecessary portion thereof. The task of the reflow unit 7 isto dissolve and deform the resist film having the first pattern so as toreshape the same into the second pattern, which will be described indetail hereinafter.

As shown in FIG. 2, the reflow unit 7 includes a processing chamber 10having a base part 10 a and an upper part 10 b detachably engaged withthe base part 10 a to form a closed processing space.

At the center portion of the interior space of the processing chamber10, a temperature adjusting plate 11 is disposed. The temperatureadjusting plate 11 has a substrate support surface (i.e., the uppersurface thereof) to support a substrate G thereon. A temperature controlwater passage 12 extends through the temperature adjusting plate 11. Thetemperature control water passage 12 is connected to a temperatureregulator 13. Water is supplied into the temperature regulator 13, inwhich the temperature of the water is adjusted, and then the water issupplied into the temperature control water passage 12 in thetemperature adjusting plate 11, thereby the temperature of the substratesupport surface of the temperature adjusting plate 11 can be controlledat a target value, and the temperature of the substrate can becontrolled at a desired value.

A thinner vapor-containing gas flow flowing downwardly in the processingchamber 10 is formed by a solvent atmosphere supply system, which iscomposed of: plural gas supply ports 14 and plural gas discharge ports15 both opening into the processing chamber 10; and gas supply pipes 16,a solvent concentration adjusting device 17, and gas discharge pipes 18disposed outside the processing chamber 10. To be specific, a thinnervapor-containing gas, i.e., an atmosphere containing a solvent, issupplied into the processing chamber 10 from the gas supply ports 14provided in the top portion of the upper part 10 b of the processingchamber 10, and the thinner vapor-containing gas thus supplied isdischarged from the processing chamber 10 from the gas discharge ports15 provided in the bottom portion of the base part 10 a of theprocessing chamber 10.

The gas supply ports 14 are connected to the gas supply pipes 16, intowhich a thinner-containing gas whose thinner concentration is adjustedto a value in a range of 50 to 100 vol. % is supplied from the solventconcentration adjusting device 17. N₂ gas is supplied into the solventconcentration adjusting device 17, and is mixed with a thinner vapor, sothat a thinner vapor-containing gas, i.e., an N₂ gas diluted thinnervapor, may be supplied into the processing chamber 10 through the gassupply pipes 16 and the gas supply ports 14. On the other hand, the gasdischarge pipes 18 are connected to the gas discharge ports 15 todischarge the atmosphere in the processing chamber 10.

The processing chamber 10 is further provided therein with: a diffusionplate 19 having plural holes that diffuses the thinner vapor-containinggas supplied through the gas supply ports 14 into the processing chamber10; an equalizing plate 20 that equalizes the distribution of theflowing direction of the thinner vapor-containing gas having beendiffused by the diffusion plate 19; and a flow rectifying plate 21 thatrectifies a gas flow flowing toward the gas discharge ports 15.

An atmospheric temperature sensor 23 is disposed in the chamber 10 todetect the atmospheric temperature in the chamber 10. The detectionresult of the atmospheric temperature sensor 23 is output to a controlunit 24, which controls the temperature regulator 13. The control unit24 controls the temperature regulator 13 to control the temperature ofthe temperature adjusting water supplied through the temperatureregulator 13 to the temperature adjusting plate 11.

Next, the operation of the reflow pattern forming apparatus 1 will bedescribed with reference to the block diagram of FIG. 1, the flowchartof FIG. 3, and substrate cross-sectional views of FIG. 6.

A cassette holding substrates G is transferred from the etchingapparatus 52 to the cassette station 2 of the reflow pattern formingapparatus 1. The arm 4 disposed in the substrate transfer unit 4 takes asubstrate G out of the cassette and transfers it to the remover unit 5.The resist film 206 formed on the substrate G has the first pattern forthe etching process which was performed in the etching apparatus 52.Note that the substrate G has been subjected to a half exposure processin the exposure apparatus 51, and thus the resist film 206 has thinportions which are to be removed before the reflow process, and thickportions which are to remain and to be subjected to the reflow process,as shown in FIG. 6( a).

In the remover unit 5, as shown in FIG. 10( b), the substrate G issubjected to a pre-treatment, i.e., an etching process that removes analtered layer formed in the surface region of the resist (photoresist)film 206 by exposing the altered layer to an alkaline solution (step S1in FIG. 3).

Then, the substrate G is transferred to the re-developing unit 6 bymeans of the arm in the substrate transfer unit 4. In the re-developingunit 6, the substrate G is subjected to a re-developing process thatremoves unnecessary thin portions of the resist film 206, and thus onlythe thick portions of the resist film 206 remain on the substrate G, asshown in FIG. 6( d) (step S2 in FIG. 3). That is, the resist film 206remains on the areas to be masked near targets Tg.

Then, the substrate G is transferred, by means of the arm in thesubstrate transfer unit 4, to the thermal treatment unit 6, in which thesubstrate G is subjected to a predetermined temperature-adjustingtreatment, i.e., a heating treatment and a cooling treatment. Then, thesubstrate G is transferred, by means of the arm in the substratetransfer unit 4, to the reflow unit 7 in which the substrate G issubjected to a reflow process that dissolves and deforms the resist film206 for a predetermined period of time, thereby the resist film 206 isreshaped into a second pattern that masks the targets G (step S3 in FIG.3).

Then, the substrate G is transferred, by means of the arm in thesubstrate transfer unit 4, to the thermal treatment unit 6, in which thesubstrate G is heated so that the resist film 206 of the second patternis fixed. Then, the substrate G is returned, by means of the arm in thesubstrate transfer unit 4, to a cassette placed on the cassette station2. Thereafter, the cassette holding the substrates G having beensubjected the above series of processes in the reflow pattern formingapparatus 1 is transferred to the etching apparatus 52, in which eachsubstrates G are subjected to the second etching process.

Next, the reflow process in the first embodiment will be described indetail with reference to the cross-sectional view of the reflow unit 7of FIG. 2, a flowchart showing process steps of the reflow process ofFIG. 4

First, the substrate G is placed on the temperature adjusting plate 11,and the temperature of the substrate support surface of the temperatureadjusting plate 11 is adjusted to a predetermined value (e.g., 24° C.)by means of the temperature regulator 13. The upper part 10 b of theprocessing chamber 10 sealingly engages with the bottom part 10 a toform a closed processing space in the processing chamber 10. Then, athinner vapor-containing gas whose concentration is adjusted to apredetermined value by the gas concentration adjusting device 17 issupplied into the processing chamber 10 so as to start the reflowprocess (Step 31 in FIG. 4).

After starting the reflow process, the atmospheric temperature sensor 23detects the atmospheric temperature in the processing chamber 10, andsends the detection signal to the control unit 24. The control unit 24compares the atmospheric temperature sent from the atmospherictemperature sensor 23 with the set temperature of the substrate supportsurface of temperature adjusting plate 11 (i.e., the target temperaturewhich is now being set in the temperature regulator 13) (Step S33 inFIG. 4).

If the detected atmospheric temperature is lower than the settemperature of the temperature adjusting plate 11, the control unit 24changes the set temperature such that the set temperature meets therequirement “Atmospheric Temperature Set Temperature (AtmosphericTemperature+2° C.)” (Steps S34 and S35 in FIG. 4).

If the detected atmospheric temperature is higher than the settemperature of the temperature adjusting plate 11, the control unit 24judges whether the set temperature is not more than “atmospherictemperature+2° C.” (Steps S34 and S37 in FIG. 4). If NO, the controlunit 24 changes the set temperature such that the set temperature meetsthe requirement “Atmospheric Temperatures Set Temperature (AtmosphericTemperature+2° C.)” (Step S35 in FIG. 4).

Thereafter, the control unit 24 judges whether the predetermined processtime defined by the process recipe has elapsed (Step S36 in FIG. 4). IfNo, the routine returns back to Step 32 and continues until thepredetermined process time elapses.

According to the foregoing embodiment, as the reflow process isperformed while maintaining the specific relationship between the settemperature and the atmospheric temperature, i.e., “AtmosphericTemperatures Set Temperature (Atmospheric Temperature+2° C.)” bycontrolling the set temperature, reflowing of the resist can beperformed stably, while achieving a satisfactory reflow rate of theresist (i.e., the amount of diffusion of the resist) although it issomewhat low and thus suppressing the reduction in the productionefficiency, as previously described in the Summary of the Inventionpart.

In the foregoing embodiment, the reflow unit 7 shown in FIG. 2 isconfigured so that the thinner vapor-containing gas supplied into theprocessing chamber 10 is not subjected to temperature adjustment.However, the configuration of the reflow unit is not limited to that inthe foregoing embodiment. The reflow unit may be configured so that thetemperature of the thinner gas can be adjusted according to the settemperature of the temperature adjusting plate 11, and may be configuredas shown in FIG. 5.

Referring to FIG. 5, the temperature adjusting water path 12 and the gassupply pipe 16 have respective spiral portions 25 which are entwinedwith each other. The thinner vapor-containing gas is supplied into theprocessing chamber 10 from the bottom portion thereof to flow upward.The thinner vapor-containing gas is heated at its spiral portion 25 bythe temperature adjusting water so that the temperature of the thinnervapor-containing gas becomes close to the temperature of the temperatureadjusting water, and thereafter is supplied into the chamber 10. If theatmospheric temperature detected by the atmospheric temperature sensor23 is lower than the set temperature of the temperature adjusting water,the thinner vapor-containing gas supplied from the concentrationadjusting device 17 passes through the spiral portion 25 where thetemperature of the thinner vapor-containing gas raises to a temperatureslightly lower (the difference is not more than 2° C.) than thetemperature adjusting water. On the contrary, if the atmospherictemperature detected by the atmospheric temperature sensor 23 is higherthan the set temperature of the temperature adjusting water, the settemperature of the temperature adjusting water is reset to a temperaturehigher than the atmospheric temperature. Accordingly, this configurationhas the advantage that the temperature of the temperature adjustingplate 11 may be set to a desired value higher than the originalatmospheric temperature.

1. A substrate processing apparatus that dissolves and deforms aphotoresist film having a first pattern formed on a substrate to reshapethe resist film into a second pattern, said apparatus comprising: aprocessing chamber; a temperature adjusting plate arranged in theprocessing chamber, the temperature adjusting plate having a substratesupporting surface on which a substrate is to be placed; a temperatureregulator adapted to control a temperature of the substrate supportingsurface to coincide with a target temperature of the substratesupporting surface so as to control a temperature of the substrate; asolvent supply system adapted to supply an atmosphere containing asolvent, the solvent having an ability to dissolve a photoresist film;an atmospheric temperature sensor adapted to detect an atmospherictemperature in the processing chamber; and a control unit adapted toreceive a detection signal expressing an atmospheric temperature in theprocessing chamber detected by the atmospheric temperature sensor, andadapted to set the target temperature of the substrate supportingsurface, the control unit being configured to compare the targettemperature which is being set at that time with the atmospherictemperature detected by the atmospheric temperature sensor and controlsthe target temperature based on a comparison result.
 2. The substrateprocessing apparatus according to claim 1, wherein the control unit isconfigured to controls the target temperature so as to satisfy thefollowing condition: the atmospheric temperature≦the targettemperature≦(the atmospheric temperature+2° C.).